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Ubicom Announces Bluetooth™
Technology Partnerships
Hardware, Software
Relationships To Enable Wireless Connectivity Solutions
MOUNTAIN VIEW, CALIF - MAY 28, 2001 - Ubicom, Inc., today announced partnerships
with two leading Bluetooth™ wireless technology developers that will lead to
high-performance, low-cost wireless connectivity solutions. The agreements
with Signia Technologies, of Milpitas, Calif., and Adamya Technologies Inc.,
of Bangalore, India, will link Ubicom’s Internet Processor chips and networking
software with Bluetooth™ communications hardware and software. This will allow
manufacturers of office equipment, home appliances, computers, and a wide range
of other devices to quickly and cost-effectively incorporate wireless communications
capabilities and Internet connectivity into their products.
"Ubicom is dedicated to making device-to-device and device-to-person
communication truly ubiquitous, and we recognize that wireless networking
will play a significant role in making that happen, with Bluetooth™ being a
key component," said Ubicom President and CEO Bulent Celebi. "Signia and
Adamya are both focused on making Bluetooth™ more cost-effective and easier
to implement, and we’re very excited to be working with them. This partnership
combines their Bluetooth™ technical capabilities with our overall networking and
semiconductor expertise, leveraging our software-based technology in a way that
will allow us to deliver powerful, integrated wireless solutions to our
customers and enabling a wide range of applications"
"Allowing our customers and partners to capitalize on the Bluetooth™ marketplace
more rapidly and cost-effectively will benefit everyone by expanding the demand
for and use of wireless technology, and creating opportunities to meet that demand,"
said Marshall Wang, CTO of Signia Technologies. Ubicom’s solution will include
Signia’s Ulysses SBT5010 Radio IC which offers a small 5mm x 5mm footprint, low
power consumption, and supports the industry standard BlueRF interface allowing
it to connect to products such as Ubicom and Adamya’s Software Radio. "We look
forward to working with Ubicom and using its unique ‘software system-on-a-chip’
technology to make wireless connectivity available to a wider user base, more
quickly and cost-effectively than can be done with all-silicon approaches,"
said Wang.
Vijay Sampath, Senior Vice President for Sales and Marketing at Adamya
Technologies Inc., said, "Adamya has developed the most compact embedded
Bluetooth™ protocol stack and baseband in the world today. A partnership
with Ubicom is a logical step because their unique value proposition is
based on implementing functionality in software to minimize silicon content,
and we fit perfectly into that model. They have the ‘best-in-class’ processor
chips for Internet connectivity and a software-based design approach that
easily accommodates our Bluetooth™ stack, and we’re extremely pleased to be
working with them."
About Signia Technologies
Signia Technologies is a premier wireless solution provider with strong expertise
in wireless integrated circuit, software, system, and networking design. Signia’s
Ulysses family of Bluetooth™ solutions includes radio and baseband ICs, protocol stacks,
antenna design, a software development kit, and manufacturing kits for products such as
PCMCIA and Compact Flash. The company works in partnership with other Bluetooth™ members,
customers, and value-added companies to provide the highest performance in Bluetooth™
using the most cost-effective technologies. Signia is an Associate Member of the Bluetooth™
Special Interest Group.
About Adamya
Adamya specializes in delivering "Very-Compact, High-Performance" embedded solutions
to customers worldwide. Adamya delivers these solutions in the areas of digital signal
processing, networking and communications, wireless communication (Bluetooth™, IEEE 802.11,
HiperLan-2) and platform technologies (RTOS, embedded Java Virtual Machine). Since its
inception in 1996, the company has registered many IPs (intellectual properties) in the
above fields, and has delivered many solutions with small footprints to the market.
These small-footprint solutions include: the Bluetooth™ protocol stack with all layers
and a 10K-byte footprint; a software baseband controller for Bluetooth™ with an 18K-byte
footprint; an embedded Java Virtual Machine platform with a 9K-byte footprint: and an RTOS
with a 956-byte footprint.
About Ubicom
Headquartered in Mountain View, California, Ubicom, Inc., enables ubiquitous communications.
Ubicom is the leading supplier of Internet Processors and protocol stacks that will connect
billions of devices to the Internet. Ubicom implements communications and control functions
as pre-built software modules that run on the Internet Processors. This approach reduces time
to production and system cost, while providing greater flexibility, compared to traditional design
approaches.
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